Secondary Processes

Cleanliness Testing:

Jaro Corp can test for the presence of ionic residues on circuit board assemblies using an Omegameter Ionograph 500 M SMD II ionic contamination tester.

Cleaning:

Although Jaro recommends that customer boards are supplied clean, in “ready to coat” condition, we recognize that this may not always be achievable.  Therefore, Jaro can perform additional cleaning using the following methods:

• IPA wash
• Solvent wipe
• Terpene solvent wash
• Plasma etching

Coating Removal:

Various chemical methods are used for either a partial or complete removal of conformal coating from PCBs. More resilient coatings may also be removed mechanically, using an ESD safe CCR2000 conformal coating removal station.

Jaro can also apply customer specified materials to meet various functional needs, per your requirements.  Examples of available processes are:

Underfilling:

Underfill is typically used to protect against shock, vibration and other mechanical stresses in certain applications.

Staking:

Staking is used to help support large or heavy components from mechanical stresses.

Potting:

Potting is the complete encapsulation of a component or a module within a resin.